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GLOBAL LEARNING CENTER,
TOHOKU UNIVERSITY

E-22(TSSP)

TSSP

Tohoku University STEM Summer Program (TSSP)

Introduction

The Tohoku University STEM Summer Program (TSSP), Exploring the Frontier of Science & Technology is designed specifically for freshmen and sophomores majoring in science and engineering (STEM). We will provide students with insight on what world society needs based on advanced science and technology in the future and how they can contribute to society through research, and we will offer cutting edge classes in advanced sciences and engineering.


TSSP Flyer (as of November 15, 2019)

 

Number of Enrollments: 30 students

TSSP_2019_image

Schedule

June 15th to July 10th, 2020


Program Schedule (as of November 15, 2019)

Curriculum

This 4-week program consists of the following 4 parts: (1) cutting edge science and technology being developed at Tohoku University; (2) science and technologies related to disasters and reduction of damage based on experiences of the Great East Japan Earthquake; (3) group problem-solving activities (hands-on experiments) to gain experience with the frontier science and technology; and (4) Japanese language and culture.
At the end of the program students will make a final (wrap-up) presentation on items (1) or (2) on their experience. The program includes experiments, lectures, facility/laboratory visits, presentation and field trips. The following topics will be covered.

 

Syllabus TSSP2020 (as of November 15, 2019)

 

(1) Cutting edge Science & Technology

Spintronics Biomolecular Design Robotics Materials Science Information Science

(2) Disaster Science & Technology

Earth Science Disaster Science in Japan Disaster Response

(3) Group Activities (Hands-on Experiments)

Challenging Experiments for Quantum Phenomena

Make and Handcraft an Efficient Motor and a Paper Airplane based on the Science and Engineering Theory

(4) Japanese Culture

Animation Aikido Zen Meditation CalligraphyFlower Arrangement

 

* Field Trips

Swordsmith in Miyagi

Tsunami Damaged Local Areas

TOYOTA Factory in Iwate

GAINAX (Animation Studio) in Fukushima

・J-PARC (Accelerator Facility) in Ibaraki


Credits

Participating students are required to take hands-on experiments and lectures, attend facility/laboratory visits and participate in group-work sessions, after which they will give wrap-up presentations. On completing these requirements, students are eligible for 8 ECTS*. These credits are not conferred at Tohoku University. Students who require credits for this program should inquire at their home universities. 

*1 ECTS credit is equivalent to 25 hours of workload. ECTS credits used to evaluate the student workload required for completion.


Eligibility

Applicants must be enrolled in full-time undergraduate degree programs at one of the listed partner institutions below. Freshmen and sophomores may be more suitable for this summer program.

Other details about application requirements will be sent to partner institutions by email.

 

Australia: University of Melbourne

Canada: University of Waterloo

China: Tsinghua University

Singapore: National University of Singapore

United Kingdom: University of York, University of East Anglia

U.S.A.: Penn State University, Purdue University, University at Albany - State University of New York (SUNY-Albany), The University of California (Berkeley, Davis, Irvine, Los Angels, San Diego, Santa Barbara, Santa Cruz, Riverside), University of Hawaii at Manoa, University of Maryland, University of Washington

 

Application Procedures

We accept the application only from nominated students.The application details will be sent to eligible students by email.


Application Deadline: March 5, 2020 (Japan Standard Time)

The application will open on December 16, 2019

Summer4

 

Program Cost

All participants are requested to pay the total program expenses of 120,000 JPY that covers all expenses for various activities during the program by specified payment deadlines. Travel, accommodations, insurance, meals, and personal daily expenses are to be paid individually. Students are advised to have sufficient money for meals and personal expenses. Payment instructions for the program expenses will be informed to the admitted applicants.

 

 Program Expenses 

 120,000

 Education 

 80,000 

 These program expenses have to be paid separately by   the specified payment deadline of each category by   credit card.
 Additional non-refundable processing fee (approx. US$   10) will be charged for each payment.

 Facilities 

 40,000 

 Accommodation

 Expense 

 179,010

 179,010 

 6,630 JPY per night including tax and breakfast

 Full payment is requested before the start of the program.
 Total  299,010   (JPY)

Accommodation

Tohoku University will arrange off-campus accommodation; ten-minutes away from Aobayama campus, where most activities are held during the program. Each student will be accommodated in a furnished individual bedroom and a bathroom. The accommodation cost is 6,630 JPY per night with breakfast. (June 14th IN, July 11th OUT)

HOTEL PEARL CITY SENDAI: https://www.pearlcity.jp/sendai/en/

Insurance

Summer program participants are required to buy travel insurance in their own country BEFORE coming to Japan. Students will be solely responsible for any accidents that occur while staying in Japan. Their insurance must cover death and medical care expenses not only due to accidental bodily injury but also for sickness.

VISA

Those who need a visa to enter Japan should indicate this on their application forms. Tohoku University will provide an invitation letter to admitted students. Passport holders of certain countries do not need a visa to enter Japan for periods of less than 90 days.

Scholarship

A JASSO (Japan student services organization) scholarship of 80,000 JPY will be offered to outstanding students who meet the JASSO requirements and successfully complete the program.

 

 

Contact

Student Exchange Division

41 Kawauchi, Aoba-ku, Sendai, Miyagi, 980-8576 Japan

Office Hours: Monday-Friday 8:30-12:30, 13:30-17:15

Tel: +81-22-795-3745

Email: tssp@grp.tohoku.ac.jp

Photo Gallery

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