With the rainy season on the way and Summer just around the corner, you know what that means!
Yes, the Tohoku University STEM Summer Program (TSSP) is back in session offering an immersive experience in cutting-edge science and engineering, Japanese culture, language and more.
This year we welcome 29 students from 6 partner universities in the USA and UK who will experience the unique culture of Tohoku University and the greater Tohoku area through the lens of lectures, lab visits and field trips. The students began their experience on Monday the 17th of June and will spend 4 weeks immersed in the innovative international program, sure to come away with lasting memories, new friends and enhanced knowledge on the world class research being performed here.